thought this patent was posted months ago with talk of stacking chips?
Liquid Metal degrade pretty fast and then you have to replace it. Also Gallium is pretty non friendly for solder, Aluminium and I don't think that it's going to be in IT sector used on mass production level. Sure patents can be done, becuase why not.
One of the ps4 pro issues was early models were very loud, some later models were much quieter, variations in heat trasnfer needed to be solved for faster ps5
Yup, mine is still dead silent, I think it's dependent from were did you get that console, heard there are like 20 factories around the world. Mine is the second revision, bought it in November 2016:
The flash makes it too dirty.Well, never cleaned it before.
Uhu
Now boot up God of War (2018) and look at the map. Now make the same video.
My PS4 pro tries to cool itself by begging for a glass of water, but I refuse. Silly console, I'm not its slave.
Outside of the Fortnite-Apple/Google debacle, there is nothing else new to talk about...this is a very old patent and has nothing to do with PS5. Why do you guys keep posting this?
oh i see, by the photo you posted i thought it was the stacking patent. gonna be really interesting to see the tear down of PS5 eventually and see what they have done.No that was chip stacking, this is liquid metal.
Never seen any noisy PS4 before, I think the lineup we get is probably a good one. It's said that there are like 20 of those, and of course each should be pointed at some markets.
If you seriously need that God of War video, I'll try to make one for you if you don't believe me.
this is a very old patent and has nothing to do with PS5. Why do you guys keep posting this?
My launch bPS4 was a jet engine, as were my friend's, with any game, Uncharted 4 and GOW made it scream so loud that I stopped playing them, now I have a ps4 slim and I couldn't be happier that thing is dead silent even under very hot weather.
Reading is hard, today is 14th august, yesterday was when exactly ?
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Liquid metal thermal paste has a very short life, compared to regular stuff, and goes bad after time (As demonstrated by several PC builders on YT).
I'll assume, and hope, this is a special new type.
OK Sony I see you. Using that Thermal Grizzly eh shordy!![]()
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WhatUhu
Now boot up God of War (2018) and look at the map. Now make the same video.
My PS4 pro tries to cool itself by begging for a glass of water, but I refuse. Silly console, I'm not its slave.
WhatBo_Hazem is not telling us is the fact that he is living in Siberia.
Opening the windows for 5 seconds keeps the PS4 cool for a day.
this is a very old patent and has nothing to do with PS5. Why do you guys keep posting this?
Then you must not be able to hear the PS4 due to the sandstormsNah, I live here, temperature is considered hot in general:
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But I usually have the AC on, so room temperature is usually around 23-25C.
And you're from Austria! It's like living in a freezer.![]()
Then you must not be able to hear the PS4 due to the sandstorms
Nah, Austria is pretty warm these days. Especially in summer.
We have 25°C just right now. Top Summer temperatures can reach from 35 to 40°C
I thought a little Mark Cerny was getting shipped inside each one to blow on it when it got hot
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I just want the teardown tbh - I'm not going to feel confident with a heatsink and a sheet of liquid metal. Probably the two pertinent parts are what problems does it solve, and whether these are generalised semiconductor issues or specific to the semiconductor used by Sony. It sounds interesting though from a purely tech point of view. Sounds like it changes state so there will be questions raised around brittleness as well. As with anything like this, the innovation looks cool it's all in the delivery when it's first generation at scale. Definitely taking a chance, but I'm surprised they wouldn't have pre-tested with the last iteration of the PS4 PRo SKU's for example. Just to make sure the process works at this level and get some early indicators.
[0004]
However, when the amount of heat generated by the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance of the grease. In the semiconductor device of Patent Document 2, instead of grease, a metal that is liquefied by heat during operation of the semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improved.
[0005]
In a structure in which a fluid metal is used as a heat conductive material, it is possible to limit the range in which the heat conductive material spreads even when the semiconductor device changes its posture or vibrates in order to sufficiently exert its cooling performance. is important. Further, it is important that the force sufficiently acts on the semiconductor chip when the radiator is pressed against the semiconductor chip. That is, the adhesion between the semiconductor chip and the radiator is also important.
Reading is hard, today is 14th august, yesterday was when exactly ?
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Priority date (day.month.year) | |
04.02.2019 We've been seeing this posted for more then a year. I still don't see any evidence its related to PS5. |
The more that's revealed about the PlayStation 5, the more plausible the argument that it may cost more than $500 or more than the Xbox Series X becomes.
Isn't that only talking about the thermal paste and not the cooling per se? It doesn't seem like liquid cooling at all
Liquid Metal cooling refers to a thermally conductive compound that would theoretically replace traditional thermal paste. It is significantly more thermally conductive than pastes, but generally has trouble staying in place. Its very effective, but its use cases are rather limited because it tends to leak out from between the cpu and the cooler and fry the motherboard. If they have an effective system for using and containing liquid metal to these problems, it'll mean a significantly more effective cooling solution than XBox Series X regardless of its thermal solution. A system that uses liquid metal generally has a 5-10 degree cooling advantage over paste and even more than that over thermal pads.What does it mean , liquid metal colling ? Is it better that the normal one , like in series X ?