Lunatic_Gamer
Gold Member
Chinese forum leaker has claimed that AMD's Zen 6, Zen 6 (Medusa) Halo APU, and next generation UDNA GPU will all be manufactured on TSMC's N3E process technology.
- Zen 6 Halo will utilize 3D stacking for improved performance, N3E.
- AMD has revived its high end/flagship graphics chips for next generation UDNA (RDNA5) architecture set to launch in 2nd half 2026, N3E.
- Zen 6 IO chiplet to be upgraded to TSMC N4C process. (Cost optimized 4nm)
- Sony's future console will similarly utilize chips with AMD's 3D stacked designs. Process unknown.
https://videocardz.com/newz/next-ge...gship-gpu-line-on-tsmc-n3e-node-claims-leaker
https://www.chiphell.com/thread-2666416-1-1.html
PS6 is design complete and in pre-si validation already, with A0 tapeout scheduled for late this year.
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